PIR Insulation Board termPIR® GK AL GK
Unbeatable solution for increasing energy
efficiency of your building!
termPIR® AL GK (2) insulation boards consist of a termPIR® board with a PIR foam core covered on both sides with a gas-tight sandwich lining based on paper, aluminum and 12.5 mm thick GK boards on both sides (one board). There is an adhesive layer between the panel with aluminum cladding and the GK boards.
-
Technical data
-
Joint types
1
Kind of core:
Rigid polyisocyanurate foam(PIR)
2
Density [kg/m3]:
p = 30 kg/m3
3
Declared heat transfer coefficient for lining λ:
λD = 0,022
4
Type of facing:
Both sides with a lining based on paper and aluminum with GK boards
5
Standard board dimensions [mm]:
1200 x 2600
6
Joint types*:
FIT - flat milling
7
Board thicknesses available:
from 20 to 250 mm
8
Board thickness [mm]:
20
30
40
50
60
70
80
90
9
Thermal resistance RD* :
0,90
1,35
1,85
2,30
2,75
3,25
3,70
4,15
10
Heat transfer coefficient U for roof* :
0,96
0,67
0,50
0,41
0,35
0,29
0,26
0,23
11
Heat transfer coefficient U for wall and floor* :
0,93
0,66
0,50
0,40
0,34
0,29
0,26
0,23
12
Board thickness [mm]:
100
110
120
130
140
150
160
-
13
Thermal resistance RD* :
4,65
5,10
5,55
6,05
6,50
6,95
7,45
-
14
Heat transfer coefficient U for roof* :
0,21
0,19
0,18
0,16
0,15
0,14
0,13
-
15
Heat transfer coefficient U for wall and floor* :
0,21
0,19
0,17
0,16
0,15
0,14
0,13
-
16
Reaction to fire (single board):
F class
17
Note:
* thermal resistance R and U coefficient apply only to PIR boards, without additional cladding
Milled edges facilitate assembly and increase thermal insulation.
Joint types:
01.FIT (flat milling from 20- 250 mm), 02. LAP (stepwise milling from 40-250 mm)*-lack, 03. TAG (tongue and groove from 40-250 mm)*- lack
* dimensions of boards with joint types are 2 to 4 % smaller